Title:
SEMICONDUCTOR LASER DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/097329
Kind Code:
A1
Abstract:
In this semiconductor laser device 1, a supply path 45 that guides a cooling fluid R supplied from a supply-opening 32 side toward a positioning region P, jetting holes 46 that jet the cooling fluid R guided by the supply path 45 below the positioning region P, and a discharge path 48 that guides the cooling fluid R jetted from the jetting holes 46 toward a discharge opening 34, are provided inside a main body 41 of a heat sink 13. The jetting holes 46 are positioned along the resonance direction D of a semiconductor laser element 12 positioned in the positioning region P, and the discharge path 48 extends in a direction intersecting the resonance direction D of the semiconductor laser element 12 positioned in the positioning region P.
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Inventors:
SUZUKI NOBUTAKA (JP)
AKIKUSA NAOTA (JP)
EDAMURA TADATAKA (JP)
AKIKUSA NAOTA (JP)
EDAMURA TADATAKA (JP)
Application Number:
PCT/JP2021/026685
Publication Date:
May 12, 2022
Filing Date:
July 15, 2021
Export Citation:
Assignee:
HAMAMATSU PHOTONICS KK (JP)
International Classes:
H01S5/024; H01L23/473; H01S5/343; H05K7/20
Domestic Patent References:
| WO2006016459A1 | 2006-02-16 |
Foreign References:
| JP2005203559A | 2005-07-28 | |||
| JP2013254907A | 2013-12-19 | |||
| JP2013033824A | 2013-02-14 | |||
| JP2005217211A | 2005-08-11 | |||
| JP2006086229A | 2006-03-30 | |||
| US20040052280A1 | 2004-03-18 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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