Title:
SEMICONDUCTOR LIGHT EMITTING DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/235565
Kind Code:
A1
Abstract:
A semiconductor light emitting device 1 according to the present invention is provided with: a semiconductor light emitting element 2 which comprises a supporting substrate 20 and a ceiling member that is positioned above the supporting substrate 20; a mounting substrate 3 on which the semiconductor light emitting element 2 is mounted in such a manner that the mounting substrate 3 faces the ceiling member; and a sealing part 26 which covers a part of the supporting substrate 20 and the lateral surface of the ceiling member in an integrated manner, and which seals the semiconductor light emitting element 2 and the mounting substrate 3.
Inventors:
ICHINOKURA HIROYASU (JP)
MAEDA TADAAKI (JP)
SAKURAGI KAZUYOSHI (JP)
MAEDA TADAAKI (JP)
SAKURAGI KAZUYOSHI (JP)
Application Number:
PCT/JP2019/022524
Publication Date:
December 12, 2019
Filing Date:
June 06, 2019
Export Citation:
Assignee:
NIKKISO CO LTD (JP)
International Classes:
H01L33/52
Domestic Patent References:
| WO2014208495A1 | 2014-12-31 |
Foreign References:
| KR20150052513A | 2015-05-14 | |||
| US20150091042A1 | 2015-04-02 | |||
| JP2014529200A | 2014-10-30 | |||
| JP2010153561A | 2010-07-08 | |||
| JP2007235122A | 2007-09-13 | |||
| JP2011210974A | 2011-10-20 |
Attorney, Agent or Firm:
HIRATA & PARTNERS (JP)
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