Title:
SEMICONDUCTOR MODULE AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/062972
Kind Code:
A1
Abstract:
A semiconductor module (1) comprises: a laminate substrate (2) composed of a laminate of an insulating plate (20) having an upper surface and a lower surface, a heat-dissipating plate (21) disposed on the lower surface of the insulating plate, and a circuit board (22) disposed on the upper surface of the insulating plate; a semiconductor element (3, 4) disposed on the upper surface of the circuit board; a case (6) surrounding the laminate substrate and housing the semiconductor element; a sealing resin (7) filling the interior of the case and sealing the semiconductor element; and a partition wall (8) extending in an upper-lower direction and dividing the sealing resin into a plurality of sections. An end of the partition wall is connected to at least a part of the upper surface of the circuit board.
Inventors:
HAYASHI NAOKI (JP)
Application Number:
PCT/JP2022/033354
Publication Date:
April 20, 2023
Filing Date:
September 06, 2022
Export Citation:
Assignee:
FUJI ELECTRIC CO LTD (JP)
International Classes:
H01L23/28; H01L25/07; H01L25/18
Foreign References:
| JP2016096188A | 2016-05-26 |
Attorney, Agent or Firm:
AOKI Hiroyoshi et al. (JP)
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