Title:
SEMICONDUCTOR MODULE AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/112662
Kind Code:
A1
Abstract:
This semiconductor module is provided with a first electroconductive member, a first semiconductor element, and a heat transfer layer. The first electroconductive member has a first main surface that faces in the thickness direction. The first semiconductor element has: a first electrode and a first gate electrode that oppose the first main surface; and, a second electrode positioned on the side opposite to the side that opposes the first main surface. The first electrode is electrically connected to the first electroconductive member. The heat transfer layer is positioned between the first main surface and the first semiconductor element, is electroconductively bonded to the first main surface, and is electrically connected to the first electrode. The heat transfer layer has a first surface that opposes the first main surface and a second surface that opposes the first semiconductor element. When viewed in the thickness direction, the second surface is positioned away from the first gate electrode. When viewed in the thickness direction, the second surface is surrounded by the peripheral edge of the first surface.
Inventors:
MOCHIZUKI YO (JP)
FUJI KAZUNORI (JP)
FUJI KAZUNORI (JP)
Application Number:
PCT/JP2022/043948
Publication Date:
June 22, 2023
Filing Date:
November 29, 2022
Export Citation:
Assignee:
ROHM CO LTD (JP)
International Classes:
H01L23/36; H01L23/48; H01L25/07; H01L25/18
Foreign References:
| JP2017054877A | 2017-03-16 | |||
| JP2018093616A | 2018-06-14 | |||
| JP2021125624A | 2021-08-30 |
Attorney, Agent or Firm:
USUI Takashi et al. (JP)
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