Title:
SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE
Document Type and Number:
WIPO Patent Application WO/2019/012738
Kind Code:
A1
Abstract:
This semiconductor module is achieved by having: a first cooling member; a semiconductor element that is provided above the first cooling member by having a first bonding layer therebetween; a pressing member that is provided above the semiconductor element by having a second bonding layer therebetween; and a first sealing material, which is provided above the first cooling member, and which seals a region positioned in the side surface direction of the semiconductor element and the pressing member. The pressing member comprises: a first block member; a second block member that is provided above the first block member; and a spring member and a second sealing material, which are provided in a region between the first block member and the second block member.
Inventors:
SUZUKI TOMOHISA (JP)
YASUDA YUUSUKE (JP)
YASUDA YUUSUKE (JP)
Application Number:
PCT/JP2018/010553
Publication Date:
January 17, 2019
Filing Date:
March 16, 2018
Export Citation:
Assignee:
HITACHI LTD (JP)
International Classes:
H01L23/40; H01L23/29; H01L23/31; H01L25/07; H01L25/18
Domestic Patent References:
| WO2017037837A1 | 2017-03-09 | |||
| WO2015104954A1 | 2015-07-16 |
Foreign References:
| JP2015122429A | 2015-07-02 | |||
| JPH1050904A | 1998-02-20 | |||
| JP2014192518A | 2014-10-06 | |||
| JP2003124406A | 2003-04-25 | |||
| JP2016169411A | 2016-09-23 | |||
| JP2011077464A | 2011-04-14 | |||
| JP2013062483A | 2013-04-04 |
Other References:
See also references of EP 3627548A4
Attorney, Agent or Firm:
TSUTSUI & ASSOCIATES (JP)
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