Title:
SEMICONDUCTOR MODULE
Document Type and Number:
WIPO Patent Application WO/2022/080072
Kind Code:
A1
Abstract:
A semiconductor module comprises: a support substrate; an electroconductive substrate supported by the support substrate; an electroconductive bonding material interposed between the support substrate and the electroconductive substrate; and a semiconductor element that is electrically bonded to the main surface of the electroconductive substrate and has a switching function. The electroconductive bonding material includes a metal base layer, a first layer, and a second layer. The first layer is interposed between the base layer and the electroconductive substrate and is directly connected to the electroconductive substrate. The second layer is interposed between the base layer and the support substrate and is directly connected to the support substrate.
Inventors:
TANIKAWA KOHEI (JP)
HAYASHI KENJI (JP)
HAYASHI KENJI (JP)
Application Number:
PCT/JP2021/033845
Publication Date:
April 21, 2022
Filing Date:
September 15, 2021
Export Citation:
Assignee:
ROHM CO LTD (JP)
International Classes:
H01L23/29; H01L23/36; H01L25/07; H01L25/18
Domestic Patent References:
| WO2016021561A1 | 2016-02-11 |
Foreign References:
| JP2020072106A | 2020-05-07 |
Attorney, Agent or Firm:
USUI Takashi et al. (JP)
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