Title:
SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE USING SAME
Document Type and Number:
WIPO Patent Application WO/2019/225088
Kind Code:
A1
Abstract:
This semiconductor package comprises: an IC chip (1) that includes a plurality of terminals (2) including radio frequency terminals; a redistribution layer (3) which covers one surface of the IC chip, the redistribution layer (3) comprising an insulating layer (4) and a plurality of redistribution traces (5) that pass through the insulating layer and include radio frequency redistribution traces (51); a plurality of connection units (6) that are connected to the other ends of the redistribution traces on the side opposite from the terminals and include radio frequency connection units (61); and a mold resin (7) that covers the IC chip. When seen from a normal direction to the one surface, the side of the contour of the IC chip closest to the plurality of radio frequency terminals is a first side (1b), and the side of the contour of the mold resin closest to the first side is a second side (7a). When seen from the normal direction, the center of the IC chip is different from the center of the mold resin. Among the distances between the contour of the IC chip and the contour of the mold resin, the distance (L1) between the first side and the second side is the shortest.
Inventors:
YASUKAWA KOICHI (JP)
KASHIWAZAKI ATSUSHI (JP)
NAKAMURA TOSHIHIRO (JP)
KASHIWAZAKI ATSUSHI (JP)
NAKAMURA TOSHIHIRO (JP)
Application Number:
PCT/JP2019/006527
Publication Date:
November 28, 2019
Filing Date:
February 21, 2019
Export Citation:
Assignee:
DENSO CORP (JP)
International Classes:
H01L23/12; H01L23/28
Domestic Patent References:
| WO2010143471A1 | 2010-12-16 |
Attorney, Agent or Firm:
JIN Shunji (JP)
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