Title:
SEMICONDUCTOR PACKAGE
Document Type and Number:
WIPO Patent Application WO/2023/229392
Kind Code:
A1
Abstract:
A semiconductor package according to an embodiment comprises: a first substrate comprising first and second pads; a first connection unit disposed on the first pad of the first substrate; a second substrate coupled to the first connection unit; a second connection unit disposed on the second pad of the first substrate; an element mounted on the second connection unit; and a molding layer disposed on the first substrate to mold the element. The element comprises at least one of a capacitor and an inductor, and the second substrate comprises a patterned layer which functions differently from the element, among the capacitor and the inductor.
Inventors:
JUNG MIN KYEONG (KR)
KWON SOON GYU (KR)
LEE HYE JIN (KR)
KWON SOON GYU (KR)
LEE HYE JIN (KR)
Application Number:
PCT/KR2023/007167
Publication Date:
November 30, 2023
Filing Date:
May 25, 2023
Export Citation:
Assignee:
LG INNOTEK CO LTD (KR)
International Classes:
H01L25/065; H01L23/31; H01L23/498; H05K1/03; H05K1/16; H05K1/18
Foreign References:
| KR20200109695A | 2020-09-23 | |||
| KR20160141561A | 2016-12-09 | |||
| US20210280507A1 | 2021-09-09 | |||
| US20210366863A1 | 2021-11-25 | |||
| KR20220042028A | 2022-04-04 |
Attorney, Agent or Firm:
HAW, Yong Noke (KR)
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