Title:
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2023/226273
Kind Code:
A1
Abstract:
The present disclosure provides a semiconductor structure and a manufacturing method therefor. The semiconductor structure comprises: a substrate; a plurality of bit lines arranged at intervals and extending in a first direction, wherein the bit lines are located in the substrate, the bit lines comprise first bit lines and second bit lines which are alternately arranged at intervals, and the first bit lines and the second bit lines are staggered in the thickness direction of the bit lines; and a plurality of semiconductor pillars arranged at intervals on the substrate, wherein the semiconductor pillars correspond to the bit lines, and the bottom surfaces of the semiconductor pillars are in contact with the surfaces of corresponding bit lines.
Inventors:
LIU YOUMING (CN)
XIAO DEYUAN (CN)
XIAO DEYUAN (CN)
Application Number:
PCT/CN2022/123893
Publication Date:
November 30, 2023
Filing Date:
October 08, 2022
Export Citation:
Assignee:
CHANGXIN MEMORY TECH INC (CN)
International Classes:
H01L23/538; H01L21/768
Foreign References:
| CN115020375A | 2022-09-06 | |||
| CN114121818A | 2022-03-01 | |||
| CN112447673A | 2021-03-05 | |||
| CN101443902A | 2009-05-27 | |||
| CN112349718A | 2021-02-09 |
Attorney, Agent or Firm:
BOXIN CHINA INTELLECTUAL PROPERTY (CN)
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