Title:
SEMICONDUCTOR STRUCTURE AND PREPARATION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2024/065906
Kind Code:
A1
Abstract:
The embodiments of the present disclosure relate to a semiconductor structure and a preparation method therefor. The semiconductor structure comprises a substrate, and one or more layers of array structures, which are arranged on one side of the substrate, each of the layers of array structures comprising: a plurality of columnar structures, which are arranged in rows in a first direction; and a plurality of word lines, which are arranged in parallel at intervals, wherein the word lines extend in the first direction, and one of the word lines penetrates one row of the columnar structures. By means of the semiconductor structure, the utilization rate of a wafer can be increased, and the process difficulty can be reduced, thereby improving the production efficiency and increasing the production yield.
Inventors:
SHAO GUANGSU (CN)
Application Number:
PCT/CN2022/126705
Publication Date:
April 04, 2024
Filing Date:
October 21, 2022
Export Citation:
Assignee:
CHANGXIN MEMORY TECH INC (CN)
International Classes:
H01L21/82
Foreign References:
| CN115101479A | 2022-09-23 | |||
| CN114121819A | 2022-03-01 | |||
| CN102522407A | 2012-06-27 | |||
| US20060113587A1 | 2006-06-01 | |||
| US20120018801A1 | 2012-01-26 |
Attorney, Agent or Firm:
ADVANCE CHINA IP LAW OFFICE (CN)
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