SENSOR DEVICE, AND METHOD FOR PRODUCING SENSOR DEVICE

WIPO Patent Application WO/2022/118965

A1

Provided are a sensor device and the like suitable for wiring of a flexible sol-gel composite piezoelectric sensor. In a sensor device 1, a sensor portion 3 and a wiring portion 5 are connected to one another. The sensor portion 3 is a sol-gel composite piezoelectric sensor. The sensor portion 3 is provided with a base material layer, a piezoelectric film layer formed on the base material layer, an electrode layer formed on the piezoelectric film layer, and a protective layer. The protective layer covers the base material layer and the electrode layer, excluding a portion thereof. The wiring portion 5 includes a signal line and a ground line. There is a pressure bonding tip at the tip end of the signal line. An upper exterior portion 7 and a lower exterior portion 9 cover at least the parts of the sensor portion 3 and the wiring portion 5 that are not covered. A pressing portion 11 pressure bonds the pressure bonding tip by pressing the same against the part of the electrode layer not covered by the protective layer. The sensor device can, for example, be attached to an inspection target using an attachment that covers the sensor portion, for example.

KOBAYASHI MAKIKO (JP)
NAKATSUMA KEI (JP)
TANABE MASAYUKI (JP)
TSUTSUMI KYOSUKE (JP)
TANAKA YUYA (JP)

PCT/JP2021/044524

June 09, 2022

December 03, 2021

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UNIV KUMAMOTO NAT UNIV CORP (JP)
CAST INC (JP)

G01L1/16; H01L41/047; H01L41/053; H01L41/113; H01L41/187; H01L41/23; H01L41/29; H01L41/318

WO2016027615A1

2016-02-25

JPH08191835A	1996-07-30
JP2002340700A	2002-11-27
JP2020068364A	2020-04-30
JP2018089621A	2018-06-14
JPH10241762A	1998-09-11
US20040164650A1	2004-08-26

HADATE Shoji (JP)

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