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Title:
SENSOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/202789
Kind Code:
A1
Abstract:
The present invention provides a sensor device configured so as to be capable of suppressing movement of foreign matter from a Peltier element to a sensor element. This sensor device comprises: a package substrate that has a recess on a first surface side, and has a plurality of terminals on a second surface side that is positioned on the opposite side to the first surface; a Peltier element that is disposed in the recess; a circuit board disposed on the opposite side to the bottom surface of the recess with the Peltier element interposed therebetween; and the sensor element attached to the opposite side to the surface facing the Peltier element in the circuit board.

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Inventors:
NAKAYAMA HIROKAZU (JP)
Application Number:
PCT/JP2020/004709
Publication Date:
October 08, 2020
Filing Date:
February 07, 2020
Export Citation:
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Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L23/38; H01L23/02; H01L27/146; H01L31/02; H01L35/30; H04N5/369
Domestic Patent References:
WO2012004923A12012-01-12
Foreign References:
JP2014036041A2014-02-24
JPS60247385A1985-12-07
JP2012197978A2012-10-18
JP2006054318A2006-02-23
JP2003258221A2003-09-12
Other References:
See also references of EP 3951849A4
Attorney, Agent or Firm:
TANAKA Hidetetsu et al. (JP)
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