Title:
SEQUENTIAL MOLDING TOOL
Document Type and Number:
WIPO Patent Application WO/2021/229254
Kind Code:
A1
Abstract:
A sequential molding tool ρδ according to the present invention includes: a holding portion attached to a sequential molding apparatus; and a free curved surface portion for pressing a metal plate. The free curved surface portion is composed of at least a hard metal base and has a hard film on the surface thereof. The surface of the hard film has an Rpk of 0.15 µm or less as defined in JIS B 0671 and calculated from a load curve of a roughness curve, and an Ra of 0.2 µm or less as defined in JIS B 0601 and calculated from a roughness curve. A smooth molded product without a rough skin layer on the processed surface thereof can thus be obtained without adding equipment for preventing adhesion.
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Inventors:
UCHIYAMA NORIKO (JP)
MIWA HIROTAKA (JP)
WATANABE HIDENORI (JP)
NANBU TOSHIKAZU (JP)
MIWA HIROTAKA (JP)
WATANABE HIDENORI (JP)
NANBU TOSHIKAZU (JP)
Application Number:
PCT/IB2020/000524
Publication Date:
November 18, 2021
Filing Date:
May 14, 2020
Export Citation:
Assignee:
NISSAN MOTOR (JP)
RENAULT SAS (FR)
RENAULT SAS (FR)
International Classes:
B21D22/18
Foreign References:
| JP2018015805A | 2018-02-01 | |||
| JP2017217657A | 2017-12-14 | |||
| JP2014095392A | 2014-05-22 | |||
| JP2017051995A | 2017-03-16 |
Other References:
See also references of EP 4151332A4
Attorney, Agent or Firm:
MATOBA, Motonori et al. (JP)
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