Title:
SHEET CUTTING APPARATUS AND SHEET CUTTING METHOD
Document Type and Number:
WIPO Patent Application WO/2007/083455
Kind Code:
A1
Abstract:
Provided is a method for cutting a sheet (S) adhered on a semiconductor wafer (W)
having a notch (N) on the outer circumference section, in accordance with the
plane shape of the semiconductor wafer (W). The sheet is cut by using a sheet cutting
apparatus (10) having a cutter blade (13) attached on a free end side. The cutter
blade (13) cuts the sheet (S) by being inserted by a displacement mechanism by
a first insertion depth in regions other than a region where the notch (N) is formed.
In the region where the notch (N) is formed, the sheet (S) is cut by a second insertion
depth shallower than the first insertion depth.
Inventors:
NONAKA HIDEAKI (JP)
KOBAYASHI KENJI (JP)
KOBAYASHI KENJI (JP)
Application Number:
PCT/JP2006/324437
Publication Date:
July 26, 2007
Filing Date:
December 07, 2006
Export Citation:
Assignee:
LINTEC CORP (JP)
NONAKA HIDEAKI (JP)
KOBAYASHI KENJI (JP)
NONAKA HIDEAKI (JP)
KOBAYASHI KENJI (JP)
International Classes:
B26D3/10; H01L21/683
Foreign References:
| JPH0469194A | 1992-03-04 | |||
| JPH10180682A | 1998-07-07 | |||
| JPS63109997A | 1988-05-14 | |||
| JPH04336996A | 1992-11-25 | |||
| JP2004122242A | 2004-04-22 | |||
| JP2005123420A | 2005-05-12 | |||
| JP2004025438A | 2004-01-29 | |||
| JPH0469192A | 1992-03-04 | |||
| JPS62236738A | 1987-10-16 | |||
| JPS61276231A | 1986-12-06 | |||
| JP2006015453A | 2006-01-19 | |||
| JP2006055935A | 2006-03-02 |
Attorney, Agent or Firm:
YAMAGUCHI, Yoshio (Izumi Building 4-1, Tsurumaki 1-chome Tama-shi Tokyo 34, JP)
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