SHEET-LIKE JOINING MATERIAL, ELECTRONIC COMPONENT EQUIPPED WITH SAME, JOINING METHOD, AND JOINED BODY

WIPO Patent Application WO/2016/157594

A1

Provided are: a sheet-like joining material which is used in cases such as when an electronic component provided with electrodes is to be mounted on a circuit board, exhibits excellent handling properties, and is capable of achieving reliable mechanical joining and excellent electrical conduction; an electronic component which uses the joining material, and exhibits excellent workability during mounting, and high conduction reliability after mounting; a joining method capable of reliably joining together objects to be joined; and a joined body exhibiting high joining reliability. The sheet-like joining material used to join members provided with electrodes includes: a crosslinked resin which is liquid between 15˚C and 25˚C inclusive; a crosslinked resin which is solid between 15˚C and 25˚C inclusive; and solder. Thermosetting resins are employed as the crosslinked resins. The content ratio of the liquid crosslinked resin to the solid crosslinked resin, expressed as a weight ratio, is in the range of 5:95 to 95:5. The solder content is in the range of 2.5 vol% to 50 vol% inclusive.

JP4389112	Semiconductor devices and their manufacturing methods
JP2022146285	LEAD-FREE SOLDER ALLOY
JPS58151037	LEAD (PB) ALLOY BRAZING MATERIAL FOR SEMICONDUCTOR DEVICE

NOMURA AKIHIRO (JP)

PCT/JP2015/081364

October 06, 2016

November 06, 2015

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MURATA MANUFACTURING CO (JP)

B23K35/26; B23K35/363; C09J7/10; C09J9/02; C09J11/04; C09J11/06; C09J163/00; C09J201/00; C22C12/00; C22C13/00; H01B1/22

WO2007125650A1	2007-11-08
WO2008023452A1	2008-02-28

JP2006096896A	2006-04-13
JP2002235060A	2002-08-23

NISHIZAWA, HITOSHI (JP)
Hitoshi Nishizawa (JP)

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