Title:
SHIELDING COMPOUND, THIN FILM FORMING METHOD USING SAME, AND SEMICONDUCTOR SUBSTRATE AND SEMICONDUCTOR DEVICE MANUFACTURED THEREFROM
Document Type and Number:
WIPO Patent Application WO/2023/177091
Kind Code:
A1
Abstract:
The present invention relates to a shielding compound, a thin film forming method using same, and a semiconductor substrate and a semiconductor device manufactured therefrom, wherein a compound with a predetermined structure is provided as a shielding agent to form, on a substrate, a uniformly thick deposition layer as a shielding region, due to a difference in adsorption distribution of the corresponding shielding agent, thereby reducing the deposition rate of the thin film and appropriately lowering the thin film growth rate, so that even when a thin film is formed on a substrate with a complicated structure, the step coverage and the thin film thickness uniformity can be greatly improved and impurities can be reduced.
Inventors:
LEE SEUNG HYUN (KR)
JUNG JAE SUN (KR)
YEON CHANG BONG (KR)
TAN KOK CHEW (KR)
CHO DEOK HYUN (KR)
NAM JI HYUN (KR)
JUNG JAE SUN (KR)
YEON CHANG BONG (KR)
TAN KOK CHEW (KR)
CHO DEOK HYUN (KR)
NAM JI HYUN (KR)
Application Number:
PCT/KR2023/001950
Publication Date:
September 21, 2023
Filing Date:
February 10, 2023
Export Citation:
Assignee:
SOULBRAIN CO LTD (KR)
International Classes:
C23C16/455; C23C16/04; C23C16/34; C23C16/40; H01L21/768
Foreign References:
| CN110092969A | 2019-08-06 | |||
| KR20100134730A | 2010-12-23 | |||
| KR20140008026A | 2014-01-21 | |||
| CN110092968A | 2019-08-06 | |||
| KR20040030507A | 2004-04-09 |
Attorney, Agent or Firm:
NEWKOREA PATENT & LAW FIRM (KR)
Download PDF: