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Patent Searching and Data


Title:
HEAT PUMP SYSTEM AND CONTROL METHOD THEREOF
Document Type and Number:
WIPO Patent Application WO/2023/177092
Kind Code:
A1
Abstract:
A heat pump system according to an aspect of the disclosed invention may comprise: a compressor that compresses a refrigerant; a water heat exchanger in which heat is exchanged between the compressed refrigerant and introduced water; an expansion valve for expanding the refrigerant condensed in the water heat exchanger; an outdoor heat exchanger in which heat is exchanged between the refrigerant expanded by the expansion valve and outdoor air; a high-tension pressure sensor that detects the temperature of the refrigerant to be condensed in the water heat exchanger; a discharged water temperature sensor that detects the temperature of water on which heat exchange has been performed in the water heat exchanger; and a control unit that determines a target condensation temperature of the refrigerant on the basis of a detection result of the discharged water temperature sensor, compares the target condensation temperature with the current condensation temperature detected by the high-tension pressure sensor, and controls the degree of opening of the expansion valve according to the comparison result.

Inventors:
KIM TAEIL (KR)
LEE SUKHO (KR)
CHANG MIN (KR)
HAN SANGYOON (KR)
Application Number:
PCT/KR2023/002123
Publication Date:
September 21, 2023
Filing Date:
February 14, 2023
Export Citation:
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Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
F25B49/02; F24D17/02; F25B1/10; F25B13/00; F25B30/02; F25B43/00
Foreign References:
JP2008232508A2008-10-02
JP2008157550A2008-07-10
KR101591191B12016-02-02
KR20210026645A2021-03-10
KR19980035253A1998-08-05
US20200191423A12020-06-18
Attorney, Agent or Firm:
SELIM INTELLECTUAL PROPERTY LAW FIRM (KR)
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