Title:
SHRINK PACKAGE
Document Type and Number:
WIPO Patent Application WO/2013/005757
Kind Code:
A1
Abstract:
Provided is a shrink package for a product which is constituted by an object to be packaged comprising an over cap and a main body, and a shrink film for packaging the object to be packaged, the over cap being opened by breaking perforations formed on the shrink film. The shrink package is characterized in that (1) favorable drop impact resistance (prevention of perforation breakage) during distribution can be maintained, and (2) a favorable openability is obtained. The position and specifications of the perforations for opening provided on the package are suitably set, and further, an air incurrent hole is provided at a specific position taking into account the easy removability of the over cap (preventing negative pressurization). Thereby, a shrink package having both drop impact resistance (prevention of perforation breakage) and openablity can be provided.
Inventors:
ANDO YUKIHIRO
Application Number:
PCT/JP2012/067045
Publication Date:
January 10, 2013
Filing Date:
July 04, 2012
Export Citation:
Assignee:
DAIICHI SANKYO CO LTD (JP)
ANDO YUKIHIRO
ANDO YUKIHIRO
International Classes:
B65D65/28; A61J1/14; A61M5/00; B65D41/62; B65D55/08; B65D71/08; B65D75/62
Foreign References:
| JP2005312932A | 2005-11-10 | |||
| JP2010070243A | 2010-04-02 | |||
| JPS61103322U | 1986-07-01 | |||
| JPH06270965A | 1994-09-27 |
Attorney, Agent or Firm:
ISHIBASHI Koki et al. (JP)
Kimiki Ishibashi (JP)
Kimiki Ishibashi (JP)
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Claims: