Title:
SIGNAL TRANSMISSION DEVICE AND INSULATION CHIP
Document Type and Number:
WIPO Patent Application WO/2023/032612
Kind Code:
A1
Abstract:
A transformer chip of this signal transmission device comprises a substrate, an element insulation layer, and a first transformer and a second transformer provided within the element insulation layer. The first transformer is provided with a first coil, and a second coil which is disposed facing the first coil in a z direction. The second transformer is provided with a first coil, and a second coil which is disposed facing the first coil in the z direction. The second coil of the first transformer and the second coil of the second transformer are electrically connected. The substrate includes a body part, and a substrate insulation layer formed on the surface of the body part. The element insulation layer is layered on the surface of the substrate insulation layer.
Inventors:
TANAKA BUNGO (JP)
Application Number:
PCT/JP2022/030341
Publication Date:
March 09, 2023
Filing Date:
August 08, 2022
Export Citation:
Assignee:
ROHM CO LTD (JP)
International Classes:
H01L27/04; H01F19/04; H01L25/04; H01L25/18; H03K17/691
Domestic Patent References:
| WO2014097425A1 | 2014-06-26 |
Foreign References:
| JP2016028407A | 2016-02-25 | |||
| JP2019009353A | 2019-01-17 | |||
| JP2020036171A | 2020-03-05 | |||
| JP2016127162A | 2016-07-11 | |||
| JP2018011173A | 2018-01-18 | |||
| JP2013012702A | 2013-01-17 | |||
| JP2002270756A | 2002-09-20 | |||
| JP2004071997A | 2004-03-04 | |||
| JP2022101068A | 2022-07-06 |
Attorney, Agent or Firm:
ONDA Makoto et al. (JP)
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