Title:
SIGNAL TRANSMITTING DEVICE AND INSULATING CHIP
Document Type and Number:
WIPO Patent Application WO/2023/032611
Kind Code:
A1
Abstract:
A transformer chip of a signal transmitting device has a substrate, an element insulation layer, and a first transformer and a second transformer provided within the element insulation layer. The first transformer comprises a first coil, and a second coil positioned facing the first coil in the z direction. The second transformer comprises a first coil, and a second coil positioned facing the first coil in the z direction. The second coil of the first transformer and the second coil of the second transformer are electrically connected. The transformer chip comprises a back surface insulating layer provided on the back surface of the substrate.
Inventors:
TANAKA BUNGO (JP)
WADA KEIJI (JP)
WADA KEIJI (JP)
Application Number:
PCT/JP2022/030340
Publication Date:
March 09, 2023
Filing Date:
August 08, 2022
Export Citation:
Assignee:
ROHM CO LTD (JP)
International Classes:
H01L25/04; H01F19/04; H01L21/822; H01L25/18; H01L27/04
Domestic Patent References:
| WO2021106363A1 | 2021-06-03 | |||
| WO2010113383A1 | 2010-10-07 |
Foreign References:
| JP2018078169A | 2018-05-17 | |||
| JP2019009353A | 2019-01-17 | |||
| US20200076512A1 | 2020-03-05 | |||
| US20210119670A1 | 2021-04-22 | |||
| JP2022101068A | 2022-07-06 |
Attorney, Agent or Firm:
ONDA Makoto et al. (JP)
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