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Title:
SILICONE COMPOSITION FOR HEAT DISSIPATION
Document Type and Number:
WIPO Patent Application WO/2006/043334
Kind Code:
A1
Abstract:
A silicone composition for heat dissipation which comprises (A) a perfluoroalkyl-containing silicone oil represented by the following general formula (1), (B) a silicone oil, and (C) a filler for heat dissipation. In the formula, R1 represents a C1-12 saturated hydrocarbon group; R2 represents hydrogen or a C1-12 (un)saturated hydrocarbon group; R3 represents aryl; Rf represents C1-12 perfluoroalkyl; R4 represents a group selected among R1, R2, R3, Rf, and OH; and l and m each is a number of 1 or larger on the average, provided that l+m+n is a number of 2 or larger.

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Inventors:
TAKEMURA KUNIO
KIMURA YASUHIRO
ARAKI JUN
NISHIMURA HIROSHI
TAKEZAWA YOSHIAKI
HOSHINO CHISATO
NISHIWAKI NOBUYUKI
Application Number:
PCT/JP2004/015747
Publication Date:
April 27, 2006
Filing Date:
October 18, 2004
Export Citation:
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Assignee:
NIPPON KOYU LTD (JP)
GE TOSHIBA SILICONES CO LTD
TAKEMURA KUNIO
KIMURA YASUHIRO
ARAKI JUN
NISHIMURA HIROSHI
TAKEZAWA YOSHIAKI
HOSHINO CHISATO
NISHIWAKI NOBUYUKI
International Classes:
C08L83/04; C08L83/08; (IPC1-7): C08L83/04; C08L83/08
Foreign References:
JP2000327917A2000-11-28
JPH03162493A1991-07-12
JPH1149958A1999-02-23
JPH04202496A1992-07-23
JP2002212422A2002-07-31
JPH09323916A1997-12-16
JPH10158401A1998-06-16
JP2000007786A2000-01-11
Attorney, Agent or Firm:
Furuya, Satoshi (2-17-8 Nihonbashi-Hamacho, Chuo-ku Tokyo 07, JP)
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