Title:
SILPHENYLENE-SKELETON-CONTAINING POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMATION METHOD, AND METHOD FOR MANUFACTURING OPTICAL SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/017666
Kind Code:
A1
Abstract:
Provided is a polymer that includes a silphenylene skeleton, an isocyanuric acid skeleton, and a hydroxy-group-substituted alkyl ether skeleton in the main chain, and that includes an epoxy group in a side chain.
Inventors:
OMORI HIROTO (JP)
MARUYAMA HITOSHI (JP)
MARUYAMA HITOSHI (JP)
Application Number:
PCT/JP2022/023304
Publication Date:
February 16, 2023
Filing Date:
June 09, 2022
Export Citation:
Assignee:
SHINETSU CHEMICAL CO (JP)
International Classes:
C08G77/60; C08G59/02; C08G77/14; C08G77/52; C08G77/54; G03F7/004; G03F7/075; G03F7/20
Domestic Patent References:
| WO2017169278A1 | 2017-10-05 |
Foreign References:
| JP2020090649A | 2020-06-11 | |||
| JP2018002848A | 2018-01-11 | |||
| JP2020090649A | 2020-06-11 | |||
| US3220972A | 1965-11-30 | |||
| US3159601A | 1964-12-01 | |||
| US3159662A | 1964-12-01 | |||
| US3775452A | 1973-11-27 |
Attorney, Agent or Firm:
PATENT PROFESSIONAL CORPORATION EI-MEI PATENT OFFICE (JP)
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