Title:
SPUTTERING TARGET AND METHOD FOR PRODUCING SPUTTERING TARGET
Document Type and Number:
WIPO Patent Application WO/2023/017667
Kind Code:
A1
Abstract:
This sputtering target is formed from multiple structural members including a target and a substrate. The multiple structural members include a first structural member and a second structural member that are layered together. The first structural member contains Al and the second structural member contains Cu. At least one of the first structural member and the second structural member contains Mg. The sputtering target contains Al and Cu between the first structural member and the second structural member and has an alloy layer contacting the first structural member and the second structural member. At least a portion of the alloy layer further includes an Mg-containing layer in which Mg content is 5.0 at% or more.
Inventors:
MURATA SHUHEI (JP)
IWABUCHI MASAYA (JP)
SATO YUSUKE (JP)
IWABUCHI MASAYA (JP)
SATO YUSUKE (JP)
Application Number:
PCT/JP2022/023495
Publication Date:
February 16, 2023
Filing Date:
June 10, 2022
Export Citation:
Assignee:
JX NIPPON MINING & METALS CORP (JP)
International Classes:
C23C14/34
Domestic Patent References:
| WO2020195030A1 | 2020-10-01 | |||
| WO2001038598A1 | 2001-05-31 |
Foreign References:
| JP2002105635A | 2002-04-10 | |||
| JPH06172993A | 1994-06-21 | |||
| JPH1177365A | 1999-03-23 | |||
| JP2003500546A | 2003-01-07 | |||
| US6755948B1 | 2004-06-29 | |||
| JP2001509548A | 2001-07-24 | |||
| US5993621A | 1999-11-30 | |||
| JP2010235998A | 2010-10-21 |
Attorney, Agent or Firm:
AXIS PATENT INTERNATIONAL (JP)
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