SILVER-COPPER COMPOSITE POWDER HAVING SILVER MICROPARTICULE ATTACHED THERETO, AND METHOD OF PRODUCTION OF THE SILVER-COPPER COMPOSITE POWDER

WIPO Patent Application WO/2007/040195

A1

Disclosed is a silver-copper composite powder having a silver microparticle attached thereto, which is finely granulated, has an even particle size, is excellent in low temperature sintering property and can be used for a wide variety of application purposes. Also disclosed is a method of production of the silver-copper composite powder. The silver-copper composite powder comprises a silver-copper composite powder and a silver microparticle attached onto the composite powder. The method of production of the silver-copper composite powder comprises the steps of: contacting a silver-copper composite powder with a solution containing a silver complex, wherein the solution is prepared by mixing and dissolving silver nitrate and a complexing agent while stirring; and adding a reducing agent to the resulting solution to thereby cause the precipitation of a silver microparticle onto the surface of a silver-copper powder.

SASAKI TAKUYA (JP)
SAKAUE TAKAHIKO (JP)
FUJIMOTO TAKU (JP)
YOSHIMARU KATSUHIKO (JP)

PCT/JP2006/319675

April 12, 2007

October 02, 2006

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MITSUI MINING & SMELTING CO (JP)
SASAKI TAKUYA (JP)
SAKAUE TAKAHIKO (JP)
FUJIMOTO TAKU (JP)
YOSHIMARU KATSUHIKO (JP)

B22F1/00; B22F1/17; C22C5/08; C22C9/00; H01B1/22; H01B5/00

JP2005146408A	2005-06-09
JP2005060831A	2005-03-10
JPH11310806A	1999-11-09
JPH07331360A	1995-12-19
JPH03133006A	1991-06-06
JPH06128609A	1994-05-10

YOSHIMURA, Katsuhiro (Omiya F Bldg. 5-4, Sakuragicho 2-chome, Omiya-k, Saitama-shi Saitama 54, JP)

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