Title:
SURFACE-TREATED COPPER FOIL, PROCESS FOR PRODUCTION OF THE SURFACE-TREATED COPPER FOIL, AND COPPER-CLAD LAMINATES MADE BY USING THE FOIL
Document Type and Number:
WIPO Patent Application WO/2007/040196
Kind Code:
A1
Abstract:
The invention aims at providing a surface-treated copper foil provided with a
silane coupling agent treatment layer, which foil is improved in the tight adhesion observed
when laminated with a resin substrate by hot pressing. In order to attain the aim,
the invention provides a surface-treated copper foil having a silane coupling
agent treatment layer on the adhesive surface to be bonded to a resin substrate,
characterized in that the silane coupling agent treatment layer is formed with
a bifunctional silane coupling agent having -Si(OCH3) functional
groups at both ends of the chemical structure. The bifunctional silane coupling
agent is any of bis-γ-trimethoxysilylpropyl- amine, bis-γ-trimethoxysilylpropylethylenediamine, and
bis-γ -trimethoxysilylethane.
Inventors:
TAKAHASHI MASARU (JP)
DOBASHI MAKOTO (JP)
DOBASHI MAKOTO (JP)
Application Number:
PCT/JP2006/319676
Publication Date:
April 12, 2007
Filing Date:
October 02, 2006
Export Citation:
Assignee:
MITSUI MINING & SMELTING CO (JP)
TAKAHASHI MASARU (JP)
DOBASHI MAKOTO (JP)
TAKAHASHI MASARU (JP)
DOBASHI MAKOTO (JP)
International Classes:
C23C26/00; B32B15/08; C23C22/00; H05K3/38
Foreign References:
| JP2000054183A | 2000-02-22 | |||
| JP2005048269A | 2005-02-24 |
Attorney, Agent or Firm:
YOSHIMURA, Katsuhiro (Omiya F Bldg. 5-4, Sakuragicho 2-chome, Omiya-k, Saitama-shi Saitama 54, JP)
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