Title:
SILVER POWDER AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2020/262115
Kind Code:
A1
Abstract:
The present invention provides: a silver powder which enables the formation of a conductive film that has a lower resistance than ever before if used as a starting material for a conductive paste that is fired so as to form the conductive film; and a method for producing this silver powder. According to the present invention, a silver powder which has three or more peaks where the frequency is highest in the volume-based particle size distribution as measured by a dry method using a laser diffraction particle size distribution measuring instrument, while having one peak where the frequency is highest in the volume-based particle size distribution as measured by a wet method using a laser diffraction/scattering particle size distribution measuring instrument, is produced by mixing a first silver powder that has one or more peaks where the frequency is highest in the volume-based particle size distribution as measured by a dry method using a laser diffraction particle size distribution measuring instrument with a second silver powder that has two or more peaks where the frequency is highest in the volume-based particle size distribution as measured by a dry method using a laser diffraction particle size distribution measuring instrument.
Inventors:
FUJII MASANORI (JP)
Application Number:
PCT/JP2020/023604
Publication Date:
December 30, 2020
Filing Date:
June 16, 2020
Export Citation:
Assignee:
DOWA ELECTRONICS MATERIALS CO (JP)
International Classes:
B22F1/00; H01B1/00; H01B1/22; H01B13/00
Domestic Patent References:
| WO2012176831A1 | 2012-12-27 | |||
| WO2016136950A1 | 2016-09-01 |
Foreign References:
| JPH06123936A | 1994-05-06 |
Attorney, Agent or Firm:
OKAWA Koichi (JP)
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