Title:
SILVER POWDER AND METHOD FOR PRODUCING SILVER POWDER
Document Type and Number:
WIPO Patent Application WO/2023/042870
Kind Code:
A1
Abstract:
Provided are: a silver powder suitable as a conductive filler for a conductive paste that can be fired at low temperature; and a method for producing the silver powder. The method for producing a silver powder comprises: an azole addition step in which an azole is added to an aqueous silver ammine complex solution to obtain a first liquid; a reducing agent addition step in which a reducing agent is added to the first liquid to obtain a second liquid; and a fatty acid addition step in which a fatty acid is added to the second liquid to obtain a third liquid, wherein the fatty acid is an unsaturated fatty acid containing two or more double bonds.
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Inventors:
SUGAWARA SATOKO (JP)
Application Number:
PCT/JP2022/034483
Publication Date:
March 23, 2023
Filing Date:
September 14, 2022
Export Citation:
Assignee:
DOWA ELECTRONICS MATERIALS CO (JP)
International Classes:
B22F9/24; B22F1/00; B22F1/052; B22F1/107; B22F9/00; H01B5/00; H01B13/00
Foreign References:
| JP2020139178A | 2020-09-03 | |||
| JP2015129352A | 2015-07-16 | |||
| JP2005220380A | 2005-08-18 | |||
| JP2016069731A | 2016-05-09 |
Attorney, Agent or Firm:
SUGIMURA Kenji (JP)
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