Title:
SINGLE WAFER-TYPE WAFER CLEANING DEVICE AND METHOD FOR CONTROLLING SURFACE ROUGHNESS OF WAFER USING SAME
Document Type and Number:
WIPO Patent Application WO/2022/163895
Kind Code:
A1
Abstract:
The present invention presents a single wafer-type wafer cleaning device and a single wafer-type method for controlling the surface roughness of a wafer, in which, in a wafer cleaning process, mutually different cleaning processes are carried out on the respective two sides of a wafer, and also, mutually different chemicals are used depending on the side of the wafer being cleaned, thereby enabling the respective roughness of the two sides to differ. The single wafer-type wafer cleaning device comprises a spin chamber, a first chemical supply device, a second chemical supply device and a third chemical supply device.
Inventors:
LEE GUN HO (KR)
LEE CHI BOK (KR)
SEO DAE KI (KR)
KO BYEONG HA (KR)
LEE CHI BOK (KR)
SEO DAE KI (KR)
KO BYEONG HA (KR)
Application Number:
PCT/KR2021/001966
Publication Date:
August 04, 2022
Filing Date:
February 16, 2021
Export Citation:
Assignee:
SK SILTRON CO LTD (KR)
International Classes:
H01L21/67; B08B3/02; H01L21/02; H01L21/687
Foreign References:
| KR20120111794A | 2012-10-11 | |||
| KR20030043739A | 2003-06-02 | |||
| KR20070003724A | 2007-01-05 | |||
| KR20200040538A | 2020-04-20 | |||
| US20130034966A1 | 2013-02-07 |
Attorney, Agent or Firm:
PARK, Byeong Suk (KR)
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