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Title:
SOFT DILUTE-COPPER ALLOY WIRE, SOFT DILUTE-COPPER ALLOY TWISTED WIRE, AND INSULATED WIRE, COAXIAL CABLE, AND COMPOSITE CABLE USING THESE
Document Type and Number:
WIPO Patent Application WO/2012/124804
Kind Code:
A1
Abstract:
Provided are a soft dilute-copper alloy wire and soft dilute-copper alloy twisted wire which have high electrical conductivity and high bending life and can limit disconnection during use compared with oxygen-free copper wire, and also provided are an insulated wire, coaxial cable, and composite cable using the soft dilute-copper alloy wire and soft dilute-copper alloy twisted wire. The soft dilute-copper alloy wire is subjected to annealing treatment by elongation processing of soft dilute-copper alloy material comprising copper and an additive element selected from the group consisting of Ti, Mg, Zr, Nb, Ca, V, Ni, Hf, Fe, Mn and Cr, with inevitable impurities as the balance, wherein the soft dilute-copper alloy wire has an average grain size that is 20 µm or less in a surface layer having a depth of 50 µm from the surface, and an elongation value that is at least 1% higher than the average elongation value of oxygen-free copper wire that has been subjected to the aforementioned annealing treatment.

Inventors:
AOYAMA SEIGI (JP)
SUMI TORU (JP)
KURODA HIROMITSU (JP)
SAGAWA HIDEYUKI (JP)
Application Number:
PCT/JP2012/056852
Publication Date:
September 20, 2012
Filing Date:
March 16, 2012
Export Citation:
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Assignee:
HITACHI CABLE (JP)
AOYAMA SEIGI (JP)
SUMI TORU (JP)
KURODA HIROMITSU (JP)
SAGAWA HIDEYUKI (JP)
International Classes:
C22C9/00; C22F1/08; H01B5/02; H01B5/08; H01B7/00; H01B11/00; H01B11/18; H01B11/20; C22F1/00
Foreign References:
JP2008001933A2008-01-10
JP2002294369A2002-10-09
JP2008041447A2008-02-21
JPH06179932A1994-06-28
JPH09157775A1997-06-17
Attorney, Agent or Firm:
HIRATA, Tadao (JP)
Tadao Hirata (JP)
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Claims: