Title:
SOLDER ALLOY AND PACKAGE STRUCTURE USING SAME
Document Type and Number:
WIPO Patent Application WO/2016/185674
Kind Code:
A1
Abstract:
A solder alloy which contains from 0.5% by mass to 1.25% by mass (inclusive) of Sb, In in an amount satisfying 5.5 ≤ [In] ≤ 5.50 + 1.06[Sb] in cases where 0.5 ≤ [Sb] ≤ 1.0, while satisfying 5.5 ≤ [In] ≤ 6.35 + 0.212[Sb] in cases where 1.0 < [Sb] ≤ 1.25 (in the formulae, [Sb] represents the Sb content (mass%) and [In] represents the In content (mass%)), from 0.5% by mass to 1.2% by mass (inclusive) of Cu, from 0.1% by mass to 3.0% by mass (inclusive) of Bi and from 1.0% by mass to 4.0% by mass (inclusive) of Ag, with the balance made up of Sn.
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Inventors:
HINE KIYOHIRO
FURUSAWA AKIO
KITAURA HIDETOSHI
FURUSAWA AKIO
KITAURA HIDETOSHI
Application Number:
PCT/JP2016/002195
Publication Date:
November 24, 2016
Filing Date:
April 26, 2016
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
B23K35/26; C22C13/00; H05K3/34
Domestic Patent References:
| WO2002040213A1 | 2002-05-23 |
Foreign References:
| JP5654716B1 | 2015-01-14 | |||
| JP2015020182A | 2015-02-02 | |||
| JP2013252548A | 2013-12-19 | |||
| CN1346728A | 2002-05-01 |
Other References:
See also references of EP 3299113A4
Attorney, Agent or Firm:
KAMATA, Kenji et al. (JP)
鎌田 健司 (JP)
鎌田 健司 (JP)
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