Title:
SOLDER ALLOY
Document Type and Number:
WIPO Patent Application WO/2016/185673
Kind Code:
A1
Abstract:
In order to improve the strength and elongation of a solder and improve the reliability of a joining portion joined by said solder, the present invention provides a solder alloy that comprises 2.0-4.0 mass% of Ag, 0.5-1.0 mass% of Cu, 0.1-0.5 mass% of an additive element selected from the group consisting of Ca and Mn, and a balance of Sn.
Inventors:
MOMOKAWA YUUKI (JP)
Application Number:
PCT/JP2016/002170
Publication Date:
November 24, 2016
Filing Date:
April 25, 2016
Export Citation:
Assignee:
NEC CORP (JP)
International Classes:
B23K35/26; C22C13/00; H05K3/34
Foreign References:
| JP2008031550A | 2008-02-14 | |||
| US20100203353A1 | 2010-08-12 | |||
| US5527628A | 1996-06-18 | |||
| JP2004261863A | 2004-09-24 | |||
| JP2010247167A | 2010-11-04 | |||
| JP2014160822A | 2014-09-04 |
Attorney, Agent or Firm:
SHIMOSAKA, NAOKI (JP)
下坂 直樹 (JP)
下坂 直樹 (JP)
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