SOLDER BALL SUPPLY DEVICE AND SOLDER BALL SUPPLY METHOD

WIPO Patent Application WO/2022/201355

A1

This solder ball supply device is applied to a solder ball feeder equipped with a feeder main unit, a track member, an excitation device, and a cavity unit, and comprises an imaging unit and a determining unit. The track member is provided to the feeder main unit in a vibratable manner and comprises a conveyance path on which a plurality of solder balls discharged from a case are conveyed. The excitation device excites the track member and conveys the plurality of solder balls on the conveyance path to a supply region from where the solder balls can be picked up by a component mounting machine. The cavity unit comprises, in the supply region, a plurality of cavities that should accommodate one solder ball among the plurality of solder balls conveyed to the supply region. The imaging unit causes an imaging device to image the cavity unit to which the plurality of solder balls have been conveyed. The determining unit performs image processing on image data of the cavity unit acquired by the imaging unit, and determines, for each of the plurality of cavities, whether or not the solder balls can be picked up by the component mounting machine.

KAWASAKI YUJI (JP)
OKADA TAKEHITO (JP)
YAMAZAKI YUSUKE (JP)

PCT/JP2021/012222

September 29, 2022

March 24, 2021

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FUJI CORP (JP)

H01L21/60; B23K3/06; H05K3/34; H05K13/02

WO2016181502A1

2016-11-17

JP2011091192A	2011-05-06
JP2002084061A	2002-03-22
JP2010517251A	2010-05-20
JP2020074472A	2020-05-14

KYORITSU INTERNATIONAL (JP)

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