Title:
SOLDER CONNECTION STRUCTURE AND FILM FORMING METHOD
Document Type and Number:
WIPO Patent Application WO/2017/110985
Kind Code:
A1
Abstract:
Provided are: a solder connection structure having improved solder wettability and including an aluminum base material; and a film forming method for forming, on the aluminum base material, a metal film having high solder wettability. The solder connection structure (50) comprises: an aluminum substrate (30); a Ni film (35) formed on the aluminum substrate by a cold spray method; and a mixed metal film (40) formed on the Ni film, by the cold spray method, by using a mixed powder material obtained by mixing Ni powder (41) and Sn powder (42).
Inventors:
HIRANO MASAKI (JP)
Application Number:
PCT/JP2016/088310
Publication Date:
June 29, 2017
Filing Date:
December 22, 2016
Export Citation:
Assignee:
TATSUTA ELECTRIC WIRE & CABLE CO LTD (JP)
International Classes:
C23C24/04; C23C28/02
Foreign References:
| JP2011212684A | 2011-10-27 | |||
| JP2011029323A | 2011-02-10 | |||
| JP2006319146A | 2006-11-24 |
Other References:
See also references of EP 3396021A4
Attorney, Agent or Firm:
FUJIOKA, Takahiro (JP)
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