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Patent Searching and Data


Title:
SOLDER PASTE DISPENSING MECHANISM AND DISPENSING METHOD THEREOF
Document Type and Number:
WIPO Patent Application WO/2017/214798
Kind Code:
A1
Abstract:
A solder paste dispensing mechanism comprises a solder paste container (1), a stencil, a squeegee, a horizontal beam (2) configured above one end of the stencil, a squeezing device (3) slidably disposed at the horizontal beam and operated with the solder paste container to squeeze solder paste; a first driving device (4) configured to drive the squeezing device to slide at the horizontal beam, and a second driving device (5) and a servo motor (6) configured to drive the squeegee to operate. The squeezing device, the first driving device, and the second driving device are connected to the servo motor and controlled by same. The servo motor controls the first driving device to drive the squeezing device to slide above the stencil, the squeezing device to squeeze the solder paste from the solder paste container on to the stencil, and then the first driving device to drive the squeezing device to reset, and the second driving device to drive the squeegee to operate and thus complete the solder paste dispensing process. The solder paste dispensing mechanism has advantages of high automation and production efficiency, a simple structure, little wastage, and low costs.

Inventors:
LUO YI (CN)
Application Number:
PCT/CN2016/085556
Publication Date:
December 21, 2017
Filing Date:
June 13, 2016
Export Citation:
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Assignee:
SHEN ZHEN SINHOVO TECH CO LTD (CN)
International Classes:
B41F15/42; B41M1/12
Foreign References:
CN101022911A2007-08-22
CN204547333U2015-08-12
US5988060A1999-11-23
US5709905A1998-01-20
US20030084797A12003-05-08
Attorney, Agent or Firm:
SHENZHEN KEGUAN INTELLECTUAL PROPERTY AGENCY CO., LTD. (CN)
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