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Patent Searching and Data


Title:
SOLDER STRIP CARRIER FILM, SOLDER STRIP COMPOSITE, AND BATTERY PIECE COMPOSITE
Document Type and Number:
WIPO Patent Application WO/2022/057138
Kind Code:
A1
Abstract:
The present invention relates to a solder strip carrier film, comprising an adhesive layer and a supporting layer. The raw material formula of the adhesive layer comprises 50-95% of a matrix resin, 0-50% of a tackifying resin, and 0-5% of an auxiliary agent; and the raw material formula of the supporting layer comprises 95-100% of a matrix resin and 0-5% of an auxiliary agent, wherein the matrix resin is one or more of a polyolefin resin and an elastomer thereof, a polyester resin and an elastomer thereof, a polyvinyl butyral ester, an ethylene-vinyl acetate copolymer, an ethylene-acrylic acid copolymer, an ionic polymer, polyamide, a fluororesin, and modifications of the above-mentioned substances; and the tackifying resin is one or more of rosin, hydrogenated rosin, petroleum resin, hydrogenated petroleum resin, phenolic resin, and terpene resin. In the present invention, by optimizing the formulas of the adhesive layer and the supporting layer, the carrier film can be properly bonded with a solder strip and a battery piece, and the carrier film is not easily pressed through.

Inventors:
HAN XIAOHANG (CN)
WANG LEI (CN)
ZHENG YA (CN)
CHEN HONGYE (CN)
WU XIAOPING (CN)
Application Number:
PCT/CN2020/139549
Publication Date:
March 24, 2022
Filing Date:
December 25, 2020
Export Citation:
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Assignee:
CYBRID TECH INC (CN)
International Classes:
C09J7/30; C08K5/134; C08K5/14; C08K5/3435; C08K13/02; C08L23/06; C08L23/08; C08L77/00; C09J7/24; C09J7/25; C09J7/29; C09J11/06; C09J11/08; C09J123/06; C09J123/08; H01L31/05
Foreign References:
CN111816723A2020-10-23
CN106833403A2017-06-13
CN111403526A2020-07-10
CN110041854A2019-07-23
CN105576046A2016-05-11
CN201868451U2011-06-15
US20100065212A12010-03-18
Attorney, Agent or Firm:
SUZHOU CREATOR PATENT & TRADEMARK AGENCY, LTD. (CN)
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