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Patent Searching and Data


Title:
SOLDER STRIP CARRIER FILM, PREPARATION METHOD THEREFOR, AND APPLICATION THEREOF
Document Type and Number:
WIPO Patent Application WO/2022/057139
Kind Code:
A1
Abstract:
The present invention relates to a solder strip carrier film. The feedstock formulation of the solder strip carrier film comprises, in mass percentage, 50-99% of a matrix resin, 0-50% of a tackifying resin, and 0-5% of an additive. The matrix resin is one or more of a polyolefin resin and an elastomer thereof, a polyester resin and an elastomer thereof, polyvinyl butyral, an ethylene-vinyl acetate copolymer, an ethylene-acrylic acid copolymer, an ionomer, polyamide, fluororesin, and modifiers of the substances above. The tackifying resin is one or more of rosin, hydrogenated rosin, a petroleum resin, a hydrogenated petroleum resin, a phenolic resin, and a terpene resin. According to the present invention, by means of the optimization of a carrier film formulation, a carrier film can be manufactured into a single-layer structure, and thus can have a support function while ensuring the bonding performance between a solder strip and a cell; and the carrier film would not be penetrated by a solder strip during lamination. The carrier film of the present invention features a simple structure, low production costs, and low equipment costs.

Inventors:
HAN XIAOHANG (CN)
WANG LEI (CN)
ZHENG YA (CN)
CHEN HONGYE (CN)
WU XIAOPING (CN)
Application Number:
PCT/CN2020/139566
Publication Date:
March 24, 2022
Filing Date:
December 25, 2020
Export Citation:
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Assignee:
CYBRID TECH INC (CN)
International Classes:
C08L23/08; C08F226/06; C08F230/08; C08F255/02; C08F289/00; C08J5/18; C08K5/134; C08K5/3435; C08L57/02; H01L31/05
Foreign References:
CN106634702A2017-05-10
CN107353847A2017-11-17
CN105385369A2016-03-09
CN110527466A2019-12-03
CN208637438U2019-03-22
CN102786883A2012-11-21
CN111403528A2020-07-10
CN111403498A2020-07-10
JP2019011439A2019-01-24
Attorney, Agent or Firm:
SUZHOU CREATOR PATENT & TRADEMARK AGENCY, LTD. (CN)
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