Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
SOLDERING FLUX AND SOLDERING PASTE
Document Type and Number:
WIPO Patent Application WO/2019/013158
Kind Code:
A1
Abstract:
The present invention addresses the problem that: if a flux contains an amount of thixotropic agent necessary for obtaining the effect of suppressing a flow due to heating, the amount of flux residue increases, and, if applied for uses that do not involve washing, a large amount of flux residue derived from the thixotropic agent remains around the soldered portions, thereby affecting chemical and electrical reliability; and that washing performance is poor in uses involving washing of the flux residue. Accordingly, this soldering flux contains nanofibers of one or more kinds from among polysaccharides, modified polysaccharides, and incompletely modified polysaccharides being modified from polysaccharides into modified polysaccharides, by an amount of not less than 50 wt ppm and not more than 3000 wt ppm with respect to a total amount of flux.

Inventors:
KITAZAWA KAZUYA (JP)
KOBAYASHI TAKAYUKI (JP)
KAWANO YUSUKE (JP)
Application Number:
JP2018/025860
Publication Date:
January 17, 2019
Filing Date:
July 09, 2018
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
SENJU METAL INDUSTRY CO (JP)
International Classes:
B23K35/363; B23K35/26; C22C13/00
Foreign References:
JP2011104638A2011-06-02
JP2005021974A2005-01-27
JP2013078799A2013-05-02
JP2011104638A2011-06-02
Other References:
See also references of EP 3653332A4
Attorney, Agent or Firm:
YAMAGUCHI INTERNATIONAL PATENT FIRM (JP)
Download PDF: