SOLDERING MATERIAL BASED ON SN AG AND CU

WIPO Patent Application WO2004096484

A3

A soldering material based on Sn Ag and Cu is disclosed, to which further alloying components Bi, Sb and, according to the invention, a proportion of 1 wt. % or less of Ni are added. A six-component alloy is thus obtained with a melting point advantageously below that of the eutectic mixture of Sn Ag and Cu at 217 DEG C and which furthermore has a high creep resistance due to the advantageous promotion of solid solution and dispersion hardening by means of Ni, such that the soldered joints formed with the soldering material are usable at application temperatures of 150 DEG C. The soldering material can also be composed of several soldering components, the final alloy composition of which comprises 1 wt. % or less of nickel.

JP6623334	Flux and solder materials
JP7068370	Solder alloys, solder balls and solder fittings
WO/2020/083529	LOW TEMPERATURE SOLDERING SOLUTIONS FOR POLYMER SUBSTRATES, PRINTED CIRCUIT BOARDS AND OTHER JOINING APPLICATIONS

ALBRECHT HANS-JUERGEN (DE)
BARTL KLAUS HEINRICH GEORG (DE)
KRUPPA WERNER (DE)
MUELLER KLAUS (DE)
NOWOTTNICK MATHIAS (DE)
PETZOLD GUNNAR (DE)
STEEN HECTOR ANDREW HAMILTON (GB)
WILKE KLAUS (DE)
WITTKE KLAUS (DE)

PCT/DE2004/000852

March 24, 2005

April 21, 2004

Click for automatic bibliography generation  

SIEMENS AG (DE)
COOKSON ELECTRONICS ASSEMBLY M (DE)
HENKEL KGAA (DE)
STANNOL GMBH (DE)
ALBRECHT HANS-JUERGEN (DE)
BARTL KLAUS HEINRICH GEORG (DE)
KRUPPA WERNER (DE)
MUELLER KLAUS (DE)
NOWOTTNICK MATHIAS (DE)
PETZOLD GUNNAR (DE)
STEEN HECTOR ANDREW HAMILTON (GB)
WILKE KLAUS (DE)
WITTKE KLAUS (DE)

B23K35/26; (IPC1-7): B23K35/26

WO2001003878A1	2001-01-18
WO2000048784A1	2000-08-24

EP0847829A1	1998-06-17
DE3830694A1	1990-03-15
EP0629466A1	1994-12-21
US6156132A	2000-12-05

View/Download PDF      PDF Help

Previous Patent: METHOD FOR WELDING PARTS

Next Patent: WELDING TORCH HOLDER