Title:
SOLID MATERIAL
Document Type and Number:
WIPO Patent Application WO/2022/138247
Kind Code:
A1
Abstract:
A solid material (1a) according to the present disclosure is provided with a three-dimensional structure (10). The three-dimensional structure (10) has a plurality of recesses (12) and a solid part (14). The solid part (14) is formed between the recesses (12). The three-dimensional structure (10) regulates the thermal conductivity of the solid material (1a) through interaction with phonons. In a plan view of the three-dimensional structure (10), a minimum dimension N of the solid part (14) between adjacent recesses (12) is 100 nm or less. The solid part (14) includes a location (14p) having an elastic modulus Ep of 80% or less of the elastic modulus Er of a reference sample.
Inventors:
FUJIKANE MASAKI
TAKAHASHI KOUHEI
TAMBO NAOKI
NAITO YASUYUKI
TAKAHASHI KOUHEI
TAMBO NAOKI
NAITO YASUYUKI
Application Number:
PCT/JP2021/045642
Publication Date:
June 30, 2022
Filing Date:
December 10, 2021
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
B82Y30/00; G01J1/02; H01L35/14; H01L35/26; H01L35/32; H01L35/34
Domestic Patent References:
| WO2019225058A1 | 2019-11-28 | |||
| WO2020174731A1 | 2020-09-03 | |||
| WO2020174732A1 | 2020-09-03 |
Foreign References:
| JP2017223644A | 2017-12-21 |
Attorney, Agent or Firm:
KAMATA Kenji et al. (JP)
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