Title:
SOLID-STATE IMAGING DEVICE AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/270371
Kind Code:
A1
Abstract:
The present technology relates to: a solid-state imaging device which makes it possible to improve the characteristics without causing a processing damage; and an electronic device. A solid-state imaging device according to the present invention comprises a pixel array part which is provided with a plurality of pixels; and the pixel array part comprises a color filter layer that is provided with a color filter, a photoelectric conversion layer that is provided with a photoelectric conversion part, an oxide film layer that is formed between the color filter layer and the photoelectric conversion layer, and a low refractive index wall that is formed of a material, which has a lower refractive index than the color filter, so as to extend from an end of the color filter layer, the end being opposite to the oxide film layer-side end, to a partway position of the oxide film layer between pixels. The present technology is able to be applied to a CMOS image sensor.
Inventors:
HOYANO MIZUKI (JP)
SAITO HIROMASA (JP)
TAKAHASHI SEIKI (JP)
KOJIMA TAKASHI (JP)
SAITO HIROMASA (JP)
TAKAHASHI SEIKI (JP)
KOJIMA TAKASHI (JP)
Application Number:
PCT/JP2022/023909
Publication Date:
December 29, 2022
Filing Date:
June 15, 2022
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L27/146
Domestic Patent References:
| WO2020003681A1 | 2020-01-02 | |||
| WO2016114154A1 | 2016-07-21 | |||
| WO2017073321A1 | 2017-05-04 |
Foreign References:
| JP2021082716A | 2021-05-27 | |||
| JP2021086931A | 2021-06-03 | |||
| JP2021068901A | 2021-04-30 | |||
| JP2018056522A | 2018-04-05 |
Attorney, Agent or Firm:
NISHIKAWA Takashi et al. (JP)
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