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Title:
CIRCUIT BOARD MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/270370
Kind Code:
A1
Abstract:
Provided is a circuit board manufacturing method wherein a carrier can easily and reliably be peeled away. This circuit board manufacturing method includes: a step in which a layered sheet that comprises a release layer and a metal layer in order on a carrier is prepared; a step in which an incision is made from the surface of the layered sheet that is on the opposite side from the carrier, such that the incision is further to the inside than an outer edge section of the layered sheet when the layered sheet is viewed in planar view and penetrates through the metal layer and the release layer when the layered sheet is viewed in cross-section, thereby partitioning the metal layer and the release layer into a center section and peripheral section, with the incision as the boundary therebetween; and a step in which a thin piece is inserted from the incision toward the center section side of the metal layer or the release layer to form a gap between the metal layer and the carrier, with the insertion angle of the thin piece with regard to a main surface of the carrier being greater than 0° when the layered sheet is viewed in cross-section.

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Inventors:
KITABATAKE YUKIKO (JP)
NAKAMURA TOSHIMI (JP)
MATSUURA YOSHINORI (JP)
Application Number:
PCT/JP2022/023905
Publication Date:
December 29, 2022
Filing Date:
June 15, 2022
Export Citation:
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Assignee:
MITSUI MINING & SMELTING CO LTD (JP)
International Classes:
H05K3/46; H01L23/12; H01L23/14; H01L23/15; H05K3/00
Domestic Patent References:
WO2014119178A12014-08-07
WO2017150283A12017-09-08
WO2017150284A12017-09-08
WO2018173807A12018-09-27
Foreign References:
JP2016001679A2016-01-07
JP2020119952A2020-08-06
JP2011009750A2011-01-13
JP2005101137A2005-04-14
JP2015035551A2015-02-19
JP2020119952A2020-08-06
Attorney, Agent or Firm:
TAKAMURA Masaharu et al. (JP)
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