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Title:
SOUND DAMPING COMPONENT FOR ULTRASONIC PROBE, ULTRASONIC PROBE, AND ULTRASONIC PROBE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2011/064934
Kind Code:
A1
Abstract:
Disclosed are a sound damping component for ultrasonic probe, an ultrasonic probe, and an ultrasonic probe manufacturing method. Multiple through-holes (14A) penetrating a sound dampening body (13a) are formed with a drill, and conductive bodies (14) are formed in each of the through-holes (14A). Then, a first electrode unit (141) for connection to a piezoelectric element drive electrode is formed in each of the conductive bodies (14) on the entry side of the aforementioned drill. By this means, a sound dampening component, an ultrasonic probe and a manufacturing method thereof can be provided such that the piezoelectric element drive electrode can be connected to the signal line, which is on the drill entry side.

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Inventors:
ASANO MASAKI (JP)
Application Number:
PCT/JP2010/006066
Publication Date:
June 03, 2011
Filing Date:
October 13, 2010
Export Citation:
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Assignee:
KONICA MINOLTA MED & GRAPHIC (JP)
ASANO MASAKI (JP)
International Classes:
A61B8/00; H04R17/00; H04R31/00
Foreign References:
JP2006253958A2006-09-21
JPH07327299A1995-12-12
JPH08197496A1996-08-06
JP2004056504A2004-02-19
JP2002142294A2002-05-17
JP2010136807A2010-06-24
Attorney, Agent or Firm:
KOTANI, Etsuji et al. (JP)
Etsuji Kotani (JP)
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