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Patent Searching and Data


Title:
SPEAKER MODULE AND HEAD-MOUNTED APPARATUS
Document Type and Number:
WIPO Patent Application WO/2023/030038
Kind Code:
A1
Abstract:
Disclosed in some embodiments of the present application are a speaker module and a head-mounted apparatus. The speaker module comprises a support, a first speaker and a second speaker, wherein the first speaker is fixedly arranged on a first surface of the support, the second speaker is fixedly arranged on a second surface of the support, and the first surface and the second surface are not coplanar; the first speaker is provided with a first diaphragm, one side of the first diaphragm close to the support is provided with a first rear sound cavity, the first speaker is provided with a first sound leakage hole, the first sound leakage hole is in communication with the first rear sound cavity, and the center line of the first sound leakage hole is parallel to the first surface of the support; and the second speaker is provided with a second diaphragm, and one side of the second diaphragm close to the support is provided with a second rear sound cavity. The speaker module of the present application can simultaneously emit a first sound wave emitted by the first speaker, a second sound wave emitted by the second speaker and a third sound wave passing through the first sound leakage hole; the first sound wave, the second sound wave and the third sound wave can be mutually offset in a far field; and the present application provides favorable conditions for solving the problem of sound leakage in the far field of an open field.

Inventors:
LI JINBAO (CN)
ZHANG JINGUO (CN)
Application Number:
PCT/CN2022/113492
Publication Date:
March 09, 2023
Filing Date:
August 19, 2022
Export Citation:
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Assignee:
GOERTEK TECH CO LTD (CN)
International Classes:
H04R1/02; G10K11/178
Foreign References:
CN113784243A2021-12-10
CN113225643A2021-08-06
CN112118339A2020-12-22
CN112839270A2021-05-25
CN103297904A2013-09-11
CN110944262A2020-03-31
US20170289675A12017-10-05
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