Title:
SPHERICAL JOINT MECHANISM AND ASSEMBLY DEVICE PROVIDED WITH SPHERICAL JOINT MECHANISM
Document Type and Number:
WIPO Patent Application WO/2014/178202
Kind Code:
A1
Abstract:
A spherical joint mechanism (10) provided with a cylindrical case (17). The axis of the cylindrical case (17) (y-axis) is a horizontal axis orthogonal to the z-axis. A spherical part (19) formed at the base end of a center shaft (11) with a cylindrical oil-less bush (18) interposed therebetween is rotatably housed in the cylindrical case (17). The center shaft (11) protrudes to the exterior through a slit (20) formed on the cylindrical case (17). A workpiece (W)-holding mechanism (12) is mounted on the protruding end. The slit (20) is formed along a circumference centered on the z-axis, and the center shaft (11) is therefore capable of turning about the spherical part (19) in a plane orthogonal to the z-axis along the slit (20).
Inventors:
ISHIDOU NORIHISA (JP)
Application Number:
PCT/JP2014/050537
Publication Date:
November 06, 2014
Filing Date:
January 15, 2014
Export Citation:
Assignee:
HONDA MOTOR CO LTD (JP)
International Classes:
F16C11/06; B23P19/00; B23P21/00; F16C11/10
Foreign References:
JPH11159522A | 1999-06-15 | |||
JPS4821726Y1 | 1973-06-25 | |||
JPS4330167Y1 | 1968-12-10 | |||
JPH0468220U | 1992-06-17 | |||
JPS62218030A | 1987-09-25 |
Attorney, Agent or Firm:
KOYAMA, YUU (JP)
Hill 有 (JP)
Hill 有 (JP)
Download PDF:
Previous Patent: RECORDING DEVICE
Next Patent: THREE-DIMENSIONAL SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR
Next Patent: THREE-DIMENSIONAL SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR