Title:
STEEL MESH OPENING DESIGN METHOD FOR BGA PACKAGING, AND COMPUTER-READABLE STORAGE MEDIUM
Document Type and Number:
WIPO Patent Application WO/2022/088817
Kind Code:
A1
Abstract:
A steel mesh opening design method for Ball Grid Array (BGA) packaging. Said method comprises: acquiring statistical data of a thermal deformation amount of a BGA solder ball region and the original weld joint height, wherein the statistical data of the thermal deformation amount comprises a BGA solder ball position and a BGA solder ball deformation amount at the position; determining a relationship between the deformation amount and the original weld joint height h to obtain a comparison result, so as to design a steel mesh opening scheme according to the comparison result; and performing compensation processing on a deformation amount at a local position according to the steel mesh opening scheme. The correspondingly reasonable size and thickness of a steel mesh opening are obtained by means of calculation by detecting deformation amounts at specific solder balls of a BGA, so that each solder ball of the BGA can obtain an appropriate soldering amount, open welding caused by BGA deformation is overcome to the maximum extent, and the reliability of welding of each solder ball of the BGA is ensured.
Inventors:
LI ZHENGGANG (CN)
QIAN SHENGJIE (CN)
LIU JISHUO (CN)
LIU FENGSHOU (CN)
QIAN SHENGJIE (CN)
LIU JISHUO (CN)
LIU FENGSHOU (CN)
Application Number:
PCT/CN2021/109984
Publication Date:
May 05, 2022
Filing Date:
August 02, 2021
Export Citation:
Assignee:
VAYO SHANGHAI TECH CO LTD (CN)
International Classes:
G06F30/20
Foreign References:
| CN112487606A | 2021-03-12 | |||
| CN111274697A | 2020-06-12 | |||
| CN101097874A | 2008-01-02 | |||
| CN110600402A | 2019-12-20 | |||
| US5641946A | 1997-06-24 |
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