STRESS SENSOR

WIPO Patent Application WO/2003/087750

A1

A stress sensor in which the application of a stress to a post(2) being fixed to a substrate (3) by an adhesive (1) stimulates a strain gage (4) disposed at said substrate (3), and the information about said stress is obtained from the change of a characteristic value of said strain gage (4), characterized in that it has a means for holding a surplus of the adhesive (1) within a specific region. The means is, for example, a continuous or intermittent convex portion (a member (5) for holding back) formed on the surface of the substrate (3) around the post (2) or a concave portion capable of receiving a surplus of the adhesive (1) formed on the surface of the substrate (3) around the post (2). The stress sensor is reduced with respect to the variation in its sensitivity resulting from the presence of the adhesive (1) fixing the post (2) to a fixed member such as the substrate (3).

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INUKAI ATSUOMI (JP)
KARASAWA FUMIAKI (JP)

PCT/JP2003/003569

October 23, 2003

March 25, 2003

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K TECH DEVICES CORP (JP)
INUKAI ATSUOMI (JP)
KARASAWA FUMIAKI (JP)

G01L5/16; G01L5/22; F16B11/00; (IPC1-7): G01L5/16; G06F3/033; F16B11/00

JP2000267803A	2000-09-29
JP6052202B2	2016-12-27
JPH10300771A	1998-11-13
EP0844584A2	1998-05-27

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