STRUCTURE, ELECTRONIC ELEMENT MODULE, HEAT EXCHANGER, FUEL ROD, AND FUEL ASSEMBLY

WIPO Patent Application WO/2014/080482

A1

The present invention has a first member (2), a second member (3) opposite the first member (2), and a glass layer (4) provided between the first member (2) and the second member (3) and used to bond the first member (2) and the second member (3); the glass transition point of the glass layer (4) being lower than the temperature of the glass layer (4) when a structure (1) is being used. Ceramic particles (4b) and/or metallic particles (4c) are dispersed in the glass layer (4). In a temperature zone of the glass layer (4) that is lower than the glass transition point of the glass layer (4), the coefficient of thermal expansion of the glass layer (4) is a value between the coefficients of thermal expansion of the first member (2) and the second member (3). Therefore, the thermal strain in the inner section of the structure caused when the structure is used at a temperature higher than room temperature can be alleviated. The first member (2) is a film formed on top of the glass layer (4) and is formed using at least one method among sputtering, vapor deposition, plating, and coating.

ISHIBASHI RYOU (JP)
NAITOU TAKASHI (JP)
KODAMA MOTOMUNE (JP)
AOYAGI TAKUYA (JP)
HINO TETSUSHI (JP)
AOYAMA MOTOO (JP)
HASHIMOTO TSUNEYUKI (JP)
TAKAHASHI KATSUHITO (JP)
SAKANO JUNICHI (JP)
NAKANO HIROSHI (JP)

PCT/JP2012/080212

May 30, 2014

November 21, 2012

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HITACHI LTD (JP)

C03C8/02; B32B17/00; C03C8/04; C03C8/08; C03C8/10; C03C8/18; F28D1/02; G21C3/20; H01L23/15

JP2867536B2	1999-03-08
JP2002308645A	2002-10-23
JP2002151810A	2002-05-24
JPH08500187A	1996-01-09

ISONO Michizo (JP)
Michizo Isono (JP)

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