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Title:
STRUCTURE EVALUATION SYSTEM, STRUCTURE EVALUATION DEVICE, AND STRUCTURE EVALUATION METHOD
Document Type and Number:
WIPO Patent Application WO/2022/014004
Kind Code:
A1
Abstract:
A structure evaluation system according to one embodiment of the present invention includes a plurality of sensors, a position location unit, a correction unit, and an evaluation unit. The plurality of sensors detect elastic waves produced from the structure. The position location unit, on the basis of a plurality of elastic waves detected by each of the plurality of sensors, locates the position of origin of the plurality of elastic waves. The correction unit, using a correction value determined on the basis of an impact, corrects information based on the position located by the position location unit. The evaluation unit evaluates the state of deterioration of the structure on the basis of the corrected information.

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Inventors:
TAKAMINE HIDEFUMI (JP)
UEDA YUKI (JP)
WATABE KAZUO (JP)
SHIOTANI TOMOKI (JP)
Application Number:
PCT/JP2020/027652
Publication Date:
January 20, 2022
Filing Date:
July 16, 2020
Export Citation:
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Assignee:
TOSHIBA KK (JP)
UNIV KYOTO (JP)
International Classes:
G01N29/14
Domestic Patent References:
WO2019167137A12019-09-06
WO2017217034A12017-12-21
Foreign References:
JP2019158899A2019-09-19
JP2010122173A2010-06-03
US8059489B12011-11-15
Attorney, Agent or Firm:
SHIGA INTERNATIONAL PATENT OFFICE (JP)
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