Title:
STRUCTURE AND METHOD FOR BRIDGE CHIP ASSEMBLY WITH CAPILLARY UNDERFILL
Document Type and Number:
WIPO Patent Application WO/2022/105637
Kind Code:
A1
Abstract:
A method for fabricating a bridge chip assembly for interconnecting two or more IC dies is provided. Each of the IC dies has a first region including first connections having a first pitch and has a second region including second connections or connection pads having a second pitch, the first pitch being greater than the second pitch. The method includes: attaching a non-conductive underfill film on an upper surface of at least the second region of each of the IC dies; bonding the second connections/connection pads of a first IC die to corresponding first connection pads/connections of a bridge chip; and bonding the second connections/connection pads of a second IC die to the bridge chip. The bridge chip assembly includes the bridge chip bonded with the first and second IC dies, and the non-conductive underfill film disposed between the bridge chip and the IC dies.
Inventors:
FAROOQ MUKTA GHATE (US)
SAKUMA KATSUYUKI (US)
SAKUMA KATSUYUKI (US)
Application Number:
PCT/CN2021/129428
Publication Date:
May 27, 2022
Filing Date:
November 09, 2021
Export Citation:
Assignee:
IBM (US)
IBM CHINA CO LTD (CN)
IBM CHINA CO LTD (CN)
International Classes:
H01L23/538; H01L23/48; H01L23/492; H01L23/52
Foreign References:
| US20190295952A1 | 2019-09-26 | |||
| US20030034128A1 | 2003-02-20 | |||
| US20140175636A1 | 2014-06-26 |
Attorney, Agent or Firm:
LIU, SHEN & ASSOCIATES (CN)
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