Title:
SUBSTRATE CLEANING METHOD AND SUBSTRATE CLEANING DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/033460
Kind Code:
A1
Abstract:
The present invention relates to a substrate cleaning method and a substrate cleaning device for cleaning a substrate such as a wafer. In the substrate cleaning method, the peripheral edge of a substrate (W) is held by a plurality of holding rollers (6), the plurality of holding rollers (6) are made to rotate around the axial centers thereof, the substrate (W) is thereby made to rotate around the axial center thereof, a two-fluid jet nozzle (2) is made to move in the radial direction of the substrate (W) while a two-fluid jet comprising a mixture of a first liquid and a gas is guided to the surface of the substrate (W) from the two-fluid jet nozzle (2), a fan-shaped jet comprising a second liquid is guided to the surface of the substrate (W) from a spray nozzle (3) while the two-fluid jet is being guided to the surface of the substrate (W), and a flow of the second liquid is formed on the surface of the substrate (W). The fan-shaped jet is separated from the two-fluid jet.
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Inventors:
KODERA KENJI (JP)
UCHIYAMA KEISUKE (JP)
YAMAMOTO SATORU (JP)
YAMANOBE HOKUTO (JP)
UCHIYAMA KEISUKE (JP)
YAMAMOTO SATORU (JP)
YAMANOBE HOKUTO (JP)
Application Number:
PCT/JP2020/027253
Publication Date:
February 25, 2021
Filing Date:
July 13, 2020
Export Citation:
Assignee:
EBARA CORP (JP)
International Classes:
H01L21/304
Foreign References:
| JP2015201627A | 2015-11-12 | |||
| JP2006093497A | 2006-04-06 | |||
| JP2017147334A | 2017-08-24 |
Other References:
See also references of EP 4020528A4
Attorney, Agent or Firm:
HIROSAWA, Tetsuya et al. (JP)
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